Intel
Module Engineer On Shift (MEOS)
$85K–$162K
US, Arizona, Phoenix · Full-time · Posted Oct 15, 2026
- Experience
- 2+ years of hands-on experience in assembly and packaging technologies or technology manufacturing; experience may be obtained through education, projects, research, jobs, or internships.
- Education
- Bachelor’s degree in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, applied technology or a related field.
- Visa sponsorship
- Not eligible for Intel immigration sponsorship.
About the job
Develops and optimizes semiconductor assembly and packaging processes, equipment, and reliability practices for next-generation products in an on-site manufacturing role.
What you'll do
- Design, test, and optimize packaging processes and equipment to meet quality, reliability, yield, cost, and manufacturability goals.
- Apply SPC and DOE, conduct simulated-field tests, and develop techniques to detect packaging quality and reliability issues.
- Manage packaging process lifecycle and collaborate with suppliers, procurement, and internal stakeholders on specifications and improvements.
What they ask for
- Bachelor’s degree in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, applied technology or a related field.
- 2+ years of hands-on experience in assembly and packaging technologies or technology manufacturing.
Nice to have
- 2+ years of experience with SPC and DOE; laser, optical systems, or semiconductor assembly processes; or semiconductor packaging/manufacturing.
- Experience with equipment adjustment, process characterization, manufacturability, or data tools such as Python, JMP, or Minitab.
Pay
$85,200.00-162,500.00 USD (target compensation; whether base salary or total pay is not specified)
Tools
Statistical Process Control (SPC), Design of Experiments (DOE), Python, JMP, Minitab
Model-written summary · the original posting is authoritative