Intel
Module Engineer On-Shift (MEOS) – Day Shift (5)
$99K–$140K
US, Arizona, Phoenix · Full-time · Posted Oct 5, 2026
- Experience
- 2+ years of relevant experience with a bachelor’s degree; a master’s degree is an alternative. Experience may include education, classes, projects, research, jobs, or internships.
- Education
- Bachelor’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline, or master’s degree in one of these disciplines.
- Visa sponsorship
- Not eligible for Intel immigration sponsorship.
About the job
Provides on-shift, real-time factory support to resolve equipment, process, and product issues and keep lots moving through Intel’s substrate packaging manufacturing line.
What you'll do
- Troubleshoot process issues, perform error recovery and lot disposition, and support new tool enabling.
- Communicate shift pass-downs and priorities; coordinate issue resolution with tool and lot owners.
- Update specifications and RFCs, and perform non-standard procedures and panel inspection and imaging.
What they ask for
- Bachelor’s degree in a listed or related discipline plus 2+ years of relevant experience, or a master’s degree in a listed or related discipline.
- Relevant experience with Metrology Tools, Exposure Lithography tools, or Laser Tools.
Nice to have
- 2+ years of experience in Statistical Process Control (SPC), Metrology tool recipe creation, and tool troubleshooting.
- Experience in Semiconductor Packaging or Packaging Substrate Manufacturing.
Pay
$99,030.00-139,810.00 USD (target compensation; type not specified)
Tools
Metrology Tools, Exposure Lithography tools, Laser Tools, Statistical Process Control (SPC)
Model-written summary · the original posting is authoritative