Intel
Module Engineer On-Shift (MEOS) – Day Shift (7)
$85K–$162K
US, Arizona, Phoenix · Full-time · Posted Oct 6, 2026
- Experience
- 2+ years of relevant experience with a bachelor's degree; alternatively, a master's degree is accepted.
- Education
- Bachelor's or master’s degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline.
- Visa sponsorship
- Not eligible for Intel immigration sponsorship.
About the job
Provides on-shift factory support for semiconductor substrate packaging manufacturing, resolving equipment, process, and product issues to maintain lot movement and production quality.
What you'll do
- Troubleshoot process issues, perform error recovery, manage lot disposition, and support new tool enabling.
- Communicate shift handoffs and priorities; coordinate with Tool and Lot Owners on issues.
- Update specifications and RFCs, and perform inspection and imaging on panels to collect development data.
What they ask for
- Bachelor's degree in a listed or related discipline and 2+ years of relevant experience, or a master's degree in a listed or related discipline.
- Relevant experience with Metrology Tools, Exposure Lithography tools, or Laser Tools.
Nice to have
- 2+ years of experience in Statistical Process Control (SPC), Metrology tool recipe creation, and tool troubleshooting.
- 2+ years of experience in Semiconductor Packaging or Packaging Substrate Manufacturing.
Pay
$85,200.00-162,500.00 USD (annual salary; base salary)
Tools
Metrology Tools, Exposure Lithography tools, Laser Tools, Statistical Process Control (SPC)
Model-written summary · the original posting is authoritative