Intel
Module Engineer On-Shift (MEOS) – Night Shift (4)
$85K–$140K
US, Arizona, Phoenix · Full-time · Posted Oct 5, 2026
- Experience
- Bachelor's degree path requires 1+ years of relevant industry experience; master's degree path has no stated experience requirement.
- Education
- Bachelor's degree in a stated or related discipline with 1+ years of relevant industry experience OR master's degree in a stated or related discipline.
- Visa sponsorship
- Not eligible for Intel immigration sponsorship.
About the job
Provides on-shift factory-floor support for semiconductor packaging manufacturing, troubleshooting equipment and process issues to maintain continuous production and lot movement.
What you'll do
- Troubleshoot process and equipment issues, perform error recovery, manage lot disposition, and support new tool enabling.
- Communicate shift priorities and provide written and verbal pass-downs to incoming and outgoing teams and stakeholders.
- Update specifications and RFCs, and perform inspections and imaging to collect development data.
What they ask for
- Bachelor's degree in materials engineering, mechanical engineering, chemical engineering, chemistry, physics, or a related discipline with 1+ years of relevant industry experience, OR a master's degree in one of those fields or a related discipline.
Nice to have
- 1+ years applying Statistical Process Control (SPC) methodologies in a manufacturing environment.
- Hands-on experience in Semiconductor Packaging or Packaging Substrate Manufacturing.
Pay
$85,200.00-139,810.00 USD (target compensation; base salary or total pay not specified)
Tools
Statistical Process Control (SPC), RFCs (Request for Change)
Model-written summary · the original posting is authoritative