Intel
Module Engineer On-Shift (MEOS) – Night Shift (6)
$99K–$140K
US, Arizona, Phoenix · Full-time · Posted Oct 5, 2026
- Experience
- Bachelor's degree route requires 1+ years of relevant industry experience; master's degree route has no years specified.
- Education
- Bachelor's or master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline.
- Visa sponsorship
- Not eligible for Intel immigration sponsorship.
About the job
Provides on-shift factory-floor support for semiconductor packaging manufacturing, resolving equipment and process issues to maintain lot movement and production continuity.
What you'll do
- Troubleshoot process and equipment issues, recover errors, manage lot disposition, and support new tool enabling.
- Communicate shift handoffs and issues to teams and stakeholders; update specifications and RFCs.
- Perform non-standard procedures, inspect and image panels, and collect development data.
What they ask for
- Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline, plus 1+ years of relevant industry experience; OR a master's degree in one of these fields.
- Position requires on-site presence.
Nice to have
- 1+ years applying Statistical Process Control (SPC) methodologies in a manufacturing environment.
- Hands-on experience in Semiconductor Packaging or Packaging Substrate Manufacturing.
Pay
$99,030.00-139,810.00 USD (target compensation; base salary or total pay not specified)
Tools
Statistical Process Control (SPC), RFCs (Request for Change)
Model-written summary · the original posting is authoritative