Intel
Module Engineering - Day Shift 5 or 7
$85K–$162K
US, Arizona, Phoenix · Full-time · Posted Oct 12, 2026
- Experience
- 1+ years with a bachelor’s degree, or a master’s degree; plus 6+ months of experience with SPC and/or DOE principles.
- Education
- Bachelor’s degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a STEM-related field; or a master’s degree in one of those fields.
- Visa sponsorship
- US citizenship required.
About the job
Develops and optimizes assembly processes, equipment, and reliability methods for Intel foundry packaging manufacturing.
What you'll do
- Design and improve assembly processes and equipment to meet quality, yield, cost, and manufacturability requirements.
- Use experiments and data analysis to define specifications, troubleshoot processes, and drive continuous improvement.
- Develop reliability testing and screening methods, and support package manufacturing, supplier standards, and customer process needs.
What they ask for
- US citizenship.
- Bachelor’s degree in a listed engineering or STEM field and 1+ years of experience, or a master’s degree in a listed field.
- 6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Nice to have
- Experience in technology or semiconductor manufacturing.
- Experience with semiconductor packaging processes, including assembly, materials, or reliability engineering in a foundry context.
Pay
$85,200.00-162,500.00 USD (annual salary range; base salary or total pay not specified)
Tools
Statistical Process Control (SPC), Design of Experiments (DOE)
Model-written summary · the original posting is authoritative