Intel
Module Engineering - Day Shift 5 or 7
$99K–$140K
US, Arizona, Phoenix · Full-time · Posted Oct 23, 2026
- Experience
- Bachelor's degree route: 1+ year of relevant experience; master's degree route: no additional years specified. Also requires 6+ months with SPC and/or DOE.
- Education
- Bachelor's or master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a STEM related field of study.
- Visa sponsorship
- Not eligible for Intel immigration sponsorship.
About the job
Develops and optimizes semiconductor packaging assembly processes, equipment, reliability testing, and manufacturing controls for Intel Foundry customers.
What you'll do
- Develop assembly processes and equipment, and evaluate silicon and packaging reliability under simulated field conditions.
- Qualify raw materials and vendors, develop screening methods, and apply process control to improve yield and detect defects.
- Ensure package designs are manufacturable and advise customers and partners on process improvements and qualification standards.
What they ask for
- Bachelor's degree in a listed engineering or STEM field plus 1+ year of relevant experience, or a master's degree in a listed field.
- 6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Nice to have
- 1+ year in technology development or semiconductor manufacturing.
- 1+ year in semiconductor packaging processes, such as assembly, material selection, or reliability engineering in a foundry context.
Pay
$99,030.00-139,810.00 USD annual base salary
Tools
Statistical Process Control (SPC), Design of Experiments (DOE)
Model-written summary · the original posting is authoritative