Intel
Module Engineering PhD Intern 2027
$121K–$121K
US, Oregon, Hillsboro · Internship · Posted Oct 8, 2026
- Experience
- 3+ months of educational, research, laboratory, internship, or industry experience.
- Education
- Currently pursuing a PhD degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.
About the job
Supports high-volume semiconductor manufacturing by leading an engineering project, analyzing manufacturing and operational data, and recommending process or operational improvements.
What you'll do
- Lead a project from problem definition through execution and final presentation.
- Analyze manufacturing, equipment, and operational data to support decision-making.
- Participate in day-to-day engineering activities and collaborate with cross-functional stakeholders.
What they ask for
- Currently pursuing a PhD in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline.
- Minimum GPA of 3.0 and coursework or research experience in semiconductor processing, materials science, microelectronics, advanced materials, or a closely related field.
- At least 3 months of educational, research, laboratory, internship, or industry experience.
- Available for a 10–12-week minimum summer internship and able to work onsite in Hillsboro, Oregon.
Nice to have
- Experience in engineering, manufacturing, data analytics, process development, or a related technical field; familiarity with semiconductor manufacturing or continuous improvement.
- Experience with data tools or methodologies such as Python, JMP, MATLAB, Power BI, Excel, SQL, root cause analysis, 8D, SPC, DOE, Lean, or Six Sigma.
Pay
$120,898.00-120,902.00 USD (target compensation; salary type not specified)
Tools
Python, JMP, MATLAB, Power BI, Excel, SQL
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