Intel
Module Engineering PhD Intern New 2027
$121K–$121K
US, Oregon, Hillsboro · Internship · Posted Sep 11, 2026
- Experience
- No number of years specified; PhD student status and relevant hands-on experience required.
- Education
- PhD student in a listed or related field.
About the job
Conduct research and develop semiconductor metal thin-film manufacturing processes, using experiments and data analysis to improve process reliability, yield, and readiness for high-volume manufacturing.
What you'll do
- Design, execute, analyze, and present process experiments and recommendations.
- Support process-flow troubleshooting, metrology optimization, and yield-improvement initiatives.
- Collaborate with fab technicians and engineering teams to develop and improve manufacturing processes.
What they ask for
- Be a PhD student in Chemical Engineering, Electrical Engineering, Material Science, Physics, Chemistry, Mechanical Engineering, or a related field.
- Know semiconductor processing fundamentals, including thin-film deposition, lithography, etching, and polishing.
- Have experience with thin-film deposition techniques and materials characterization, plus hands-on lab or fab equipment experience.
- Have data analysis skills, including ability to develop data-based problem statements and design experiments.
Nice to have
- Be a third- or fourth-year PhD student.
- Have experience with thin-film deposition and characterization.
Pay
$120,898.00-120,902.00 USD (total compensation)
Tools
ALD, CVD, PVD, electroplating, ellipsometry, XRF, XPS, XRR
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