Drimva

Intel

Module Equipment Technician

$60K–$117K

US, Arizona, Phoenix · Full-time · Posted Aug 20, 2026

Experience
Pathways include: BS STEM related to semiconductor manufacturing (MET) or BS STEM (operator), with no experience stated; HS/GED or higher non-semi degree plus 4+ years related hands-on or military technical experience; HS/GED or higher non-semi degree plus 2.5+ years related equipment maintenance experience; HS/GED or higher non-semi degree plus 3+ years technical/trade certification or technical experience; or an associate STEM degree related to semiconductor manufacturing (MET) or STEM (operator) plus 2+ years related equipment maintenance experience.
Education
See minimum-qualification pathways; equivalent experience is not stated.
Visa sponsorship
This position is not open to Intel immigration sponsorship.

About the job

Maintains and troubleshoots semiconductor manufacturing equipment to support wafer production and fab objectives.

What you'll do

  • Perform wafer-production operations, equipment, process, and training functions.
  • Maintain, repair, and troubleshoot equipment; support defect reduction.
  • Use technical documentation, tools, and test equipment to solve problems.

What they ask for

  • Meet at least one stated education or experience pathway, including a relevant STEM bachelor’s degree or specified combinations of education and related experience.
  • Work the compressed schedule of three consecutive 12-hour shifts, with the stated alternating schedule.
  • Work in a cleanroom wearing required PPE, lift up to 35 pounds (18 kgs) four times daily, and frequently stand, walk, bend, and reach.

Nice to have

  • Military experience; advanced-node semiconductor manufacturing experience.
  • Hands-on preventive and corrective maintenance on 300mm semiconductor equipment (or equivalent experience); process-control systems or schematics experience.

Pay

$60,450.00-116,640.00 USD (base salary; hourly role)

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 5, 2026 (UTC)