Intel
Oregon Advanced Packaging Module Engineer
$76K–$146K
US, Oregon, Hillsboro · Full-time · Posted Oct 27, 2026
- Experience
- Bachelor’s degree route: 1+ years of hands-on experience; alternatively, a Master’s degree in a matching STEM discipline. Also specifies 6+ months applying statistical methods to manufacturing processes.
- Education
- Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related STEM field; or a Master’s degree in a matching STEM discipline.
About the job
Owns high-volume advanced packaging equipment and processes, ensuring process control, preventing excursions, transferring technology, and improving semiconductor manufacturing operations.
What you'll do
- Manage high-volume packaging equipment and processes, including process control, metrology, and excursion prevention.
- Coordinate global technology transfers, factory ramp equipment installations and qualifications, and supplier collaboration.
- Lead continuous improvement initiatives in safety, quality, productivity, cost reduction, and defect reduction.
What they ask for
- Bachelor’s degree in a listed or related STEM field and 1+ years of hands-on experience in semiconductor manufacturing or high-tech process equipment, or a Master’s degree in a matching STEM discipline.
- 6+ months of experience applying statistical methods to manufacturing processes.
- Relevant experience may come from internships, academic projects, coursework, or hands-on technical training.
Nice to have
- 6+ months troubleshooting equipment or analytical instruments in a semiconductor environment.
- 6+ months using MATLAB, JMP, or Excel for process optimization, or using materials characterization techniques.
Pay
$76,390.00-146,440.00 USD (annual salary range; base salary)
Tools
Statistical Process Control, design of experiments, MATLAB, JMP, Excel
Model-written summary · the original posting is authoritative