Intel
Packaging Module Development Engineer
$156K–$220K
US, Oregon, Hillsboro · Full-time · Posted Oct 29, 2026
- Experience
- 6+ years with a bachelor’s degree, 4+ years with a master’s degree, or 2+ years with a PhD; semiconductor manufacturing experience is required.
- Education
- Bachelor’s, master’s, or PhD in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field.
About the job
Develops and improves metrology capabilities, equipment, and manufacturing processes for Intel’s next-generation semiconductor packaging technologies.
What you'll do
- Evaluate emerging metrology technologies and contribute to technology roadmaps and pathfinding initiatives.
- Install, qualify, characterize, and validate equipment; develop and optimize recipes and manufacturing processes.
- Monitor equipment and processes, investigate excursions, perform root cause analysis, and implement improvements with cross-functional teams.
What they ask for
- Bachelor’s degree in a listed or related STEM field and 6+ years of semiconductor manufacturing experience; or a master’s degree in the same fields and 4+ years; or a PhD in the same fields and 2+ years.
- Experience must include manufacturing process development and application of statistical process control (SPC), data analysis, and/or process improvement methodologies.
Nice to have
- Experience owning, sustaining, or optimizing semiconductor metrology or inspection equipment, including equipment recipes and process performance.
- Experience with technology development initiatives, equipment capability evaluations, or future technology roadmaps; technical leadership and cross-functional collaboration.
Pay
$155,520.00-219,550.00 USD (annual target compensation)
Tools
metrology, inspection equipment, statistical process control (SPC)
Model-written summary · the original posting is authoritative