Intel
Packaging Module Development Engineer
$134K–$189K
US, Arizona, Phoenix · Full-time · Posted Oct 27, 2026
- Experience
- 6+ months of relevant industry experience for candidates with a Bachelor’s or Master’s degree; no experience duration stated for PhD candidates.
- Education
- Bachelor’s or Master’s degree in engineering, Physics, Chemistry, or a related STEM field; OR PhD in Engineering, Physics, Chemistry, or a related STEM field.
About the job
Develops, optimizes, and qualifies semiconductor packaging assembly processes and equipment, supporting product development and high-volume manufacturing.
What you'll do
- Develop, optimize, and qualify packaging processes and equipment to meet quality, reliability, yield, and cost targets.
- Lead experiments and process characterization using DOE and SPC; document findings and improvements.
- Work with cross-functional teams and suppliers to address technical risks, set specifications, and standardize manufacturing processes.
What they ask for
- Bachelor’s or Master’s degree in engineering, Physics, Chemistry, or a related STEM field, plus 6+ months of relevant industry experience; OR PhD in Engineering, Physics, Chemistry, or a related STEM field.
- Relevant experience in SPC and DOE, process development, equipment qualification and characterization in packaging or manufacturing, or data analysis and risk assessment.
Nice to have
- 6+ months leading technical teams and collaborating across matrixed organizations; experience with semiconductor fabrication, assembly, and packaging flows.
- Knowledge of machine vision, automated inspection, and camera-based measurement; programming with Python, MATLAB, or SQL.
Pay
$133,800.00-188,890.00 USD (target compensation; base salary or total pay not specified)
Tools
Statistical Process Control (SPC), Design of Experiments (DOE), Python, MATLAB, SQL
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