Intel
Packaging Module Development Engineer
$134K–$189K
US, Arizona, Phoenix · Full-time · Posted Oct 23, 2026
- Experience
- 1+ years in materials characterization, packaging process development, or mechanical testing; relevant experience may come from academic research, coursework, internships, or industry experience. Preferred qualifications include 1+ years in specified areas.
- Education
- Master’s Degree or PhD in a listed or related STEM field.
About the job
Develops advanced semiconductor packaging solutions focused on thermal interfaces and warpage mitigation, qualifying materials and equipment and optimizing assembly processes for high-volume manufacturing.
What you'll do
- Develop, qualify, and implement thermal interface and warpage mitigation solutions; investigate materials, equipment, and fabrication processes.
- Optimize assembly processes for quality, reliability, cost, yield, productivity, and scalability; provide sustaining support and resolve packaging failures and customer technical requests.
- Manage engineering project milestones and collaborate with cross-functional teams.
What they ask for
- Master’s Degree or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, Applied Physics, or a related STEM field.
- 1+ years of experience in materials characterization, packaging process development, or mechanical testing.
- Minimum GPA of 3.5 on a 4.0 scale.
- At least one publication as a primary or contributing author in a peer-reviewed technical journal.
Nice to have
- 1+ years of semiconductor packaging technology development, including hands-on application of Statistical Process Control (SPC) or Design of Experiments (DOE).
- 1+ years executing complex engineering projects in a semiconductor foundry or manufacturing environment, or using Python, MATLAB, or SQL to analyze engineering datasets.
Pay
$133,800.00-188,890.00 USD (annual salary; target compensation)
Tools
Statistical Process Control (SPC), Design of Experiments (DOE), Python, MATLAB, SQL
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