Intel
Packaging Module Development Engineer
$134K–$189K
US, Arizona, Phoenix · Full-time · Posted Oct 13, 2026
- Experience
- 1+ years in statistical analysis and 1+ years in relevant process development, characterization, optimization, or qualification.
- Education
- PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
About the job
Develops and improves semiconductor packaging assembly processes, equipment, and qualification methods to meet manufacturing, quality, reliability, and product roadmap needs.
What you'll do
- Develop and optimize packaging processes and equipment using experimental design, statistical methods, and data analysis.
- Establish reliability and material requirements, identify potential quality problems, and ensure package designs and processes are manufacturable.
- Coordinate with suppliers and partner engineering groups on material quality, process maturity, and product qualification.
What they ask for
- PhD in Mechanical Engineering, Materials Science, Electrical Engineering, Physics/Applied Physics, or a related field.
- 1+ years applying statistical analysis techniques, including Design of Experiments (DOE), Statistical Process Control (SPC), and data-driven problem solving for technical root cause analysis.
- 1+ years in process development, characterization, optimization, or qualification in semiconductor manufacturing, packaging, materials engineering, or related advanced technology environments.
Nice to have
- Experience with Python, MATLAB, JMP, Minitab, or equivalent software.
- Knowledge of reliability engineering, failure mechanisms, and accelerated stress testing methods.
Pay
$133,800.00-188,890.00 USD (base salary)
Tools
Design of Experiments (DOE), Statistical Process Control (SPC), Python, MATLAB, JMP, Minitab
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