Intel
Packaging Module Equipment Development Engineer
$99K–$189K
US, Arizona, Phoenix · Full-time · Posted Oct 12, 2026
- Experience
- Bachelor's degree route: 2+ years of relevant experience; Master's degree route: 1+ years; PhD route: no additional years stated.
- Education
- Bachelor's or Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, or a PhD in one of those fields.
- Visa sponsorship
- US Citizenship.
About the job
Develops and optimizes packaging assembly processes and equipment to support reliable, high-volume semiconductor manufacturing.
What you'll do
- Develop and optimize assembly processes and equipment against quality, reliability, cost, yield, productivity, and manufacturability goals.
- Use DOE and statistical methods to improve processes and equipment, document findings, and address equipment health and reliability.
- Support manufacturability of package designs, new materials, and architectures; lead problem-solving and continuous improvement.
What they ask for
- US Citizenship.
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience; OR a Master's degree in one of those fields with 1+ years; OR a PhD in one of those fields.
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
Nice to have
- Experience with high-volume manufacturing, including equipment troubleshooting and change qualification.
- Understanding of semiconductor fabrication and packaging technologies; familiarity with equipment installation and qualification.
Pay
$99,030.00-188,890.00 USD (annual salary range; base salary or total pay not specified)
Tools
Statistical Process Control (SPC), Design of Experiments (DOE)
Model-written summary · the original posting is authoritative