Intel
Packaging Module Equipment Development Engineer
$134K–$189K
US, Arizona, Phoenix · Full-time · Posted Oct 26, 2026
- Experience
- Minimum experience depends on degree: 4+ years with a bachelor’s, 3+ years with a master’s, or 6+ months with a PhD, in relevant semiconductor industry experience. Preferred qualifications include 2+ years in specified areas.
- Education
- Bachelor’s degree in Mechanical, Electrical, Material Science or Chemical Engineering, or a related STEM field; OR a master’s or PhD in a matching STEM discipline.
About the job
Develops and qualifies semiconductor packaging assembly processes and equipment, tests reliability, and standardizes manufacturing across Intel factories.
What you'll do
- Develop, optimize, and qualify packaging processes, materials, and equipment configurations; integrate equipment with a focus on dispense, mold, and/or cure technologies.
- Design reliability testing and simulations, apply DOE and SPC, and analyze manufacturing data to improve process windows, yield, and quality.
- Coordinate suppliers and cross-functional teams, standardize manufacturing across sites, and document qualifications and technology transfers.
What they ask for
- Bachelor’s degree in Mechanical, Electrical, Material Science or Chemical Engineering, or a related STEM field, with 4+ years of relevant semiconductor industry experience; OR a matching STEM master’s degree with 3+ years; OR a matching STEM PhD with 6+ months.
- Experience utilizing SPC or DOE principles in a high-tech manufacturing environment.
- Experience managing technical change control, equipment sustaining, or quality data systems.
- Structured problem solving, including developing hypotheses and data-driven validation plans.
Nice to have
- 2+ years of hands-on semiconductor packaging process development or equipment engineering experience.
- 2+ years managing first-time process integration, tooling selection, or equipment qualifications involving dispense, mold, or cure hardware; or managing technical projects through manufacturing transfer.
Pay
USD 133,800.00-188,890.00 annual base salary
Tools
Statistical Process Control (SPC), Design of Experiments (DOE), dispense, mold, cure
Model-written summary · the original posting is authoritative