Intel
Packaging Module Equipment Development Engineer
$85K–$140K
US, Arizona, Phoenix · Full-time · Posted Oct 29, 2026
- Experience
- Entry-level position; relevant experience may come from schoolwork, classes, project work, internships, military training, and/or work experience. Preferred qualifications include 6+ months of experience in specified areas.
- Education
- A Bachelor's, Master's in Engineering, Physics, Chemistry, or a related STEM discipline.
About the job
Develops and qualifies semiconductor packaging assembly processes and equipment to improve manufacturing performance, product reliability, and manufacturability.
What you'll do
- Develop, optimize, and qualify packaging assembly processes and hardware configurations against quality, reliability, cost, yield, productivity, and manufacturability targets.
- Use DOE and SPC to characterize processes and equipment, document improvements, and develop specifications.
- Support package manufacturability, supplier and material standards, early risk screening, reliability requirements, and manufacturing standardization.
What they ask for
- Bachelor's or Master's in Engineering, Physics, Chemistry, or a related STEM discipline.
Nice to have
- 6+ months of hands-on semiconductor experience or academic research supporting or developing manufacturing equipment.
- Experience with dispense, mold, and/or cure packaging equipment; SPC and/or DOE; semiconductor fabrication, equipment sustaining, change control, or quality data systems; or complex technical projects.
Pay
$85,200.00-139,810.00 USD (total compensation)
Tools
Design of Experiments (DOE), Statistical Process Control (SPC)
Model-written summary · the original posting is authoritative