Intel
Packaging Process Development Engineer
$99K–$189K
US, Arizona, Phoenix · Full-time · Posted Oct 7, 2026
- Experience
- 2+ years with a bachelor's degree; a master's degree is an alternative.
- Education
- Bachelor's or master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.
About the job
Develops and optimizes semiconductor packaging assembly processes, materials, and equipment to meet product quality, reliability, cost, and manufacturing goals.
What you'll do
- Develop and optimize assembly media and collaterals using DOE and SPC, and document results in technical reports.
- Design and maintain equipment for performance evaluation; ensure prototype manufacturability and oversee manufacturing workflows.
- Define material specifications, establish reliability benchmarks, and lead problem-solving and continuous-improvement efforts with internal teams and suppliers.
What they ask for
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, with 2+ years of experience; OR a master's degree in one of these fields or a related STEM field.
- Knowledge of mechanical design software such as SolidWorks or AutoCAD.
- Experience with mechanical drawings and Geometric Dimensioning and Tolerancing (GD&T) principles.
Nice to have
- 2+ years of experience with Statistical Process Control (SPC) and Design of Experiments (DOE) methodologies.
- Experience in high-precision manufacturing, semiconductor packaging, or supply chain management in manufacturing or materials qualification.
Pay
$99,030.00-188,890.00 USD (base salary)
Tools
SolidWorks, AutoCAD, Design of Experiments (DOE), Statistical Process Control (SPC), stamping, CNC machining
Model-written summary · the original posting is authoritative