Intel
Principal Engineer, Hybrid Bonding Module
$211K–$298K
US, Oregon, Hillsboro · Principal · Full-time · Posted Jun 1, 2026
- Experience
- Bachelor's degree + 15+ years of experience, or Master's degree + 10+ years of experience, or PhD + 8+ years of experience.
- Education
- Degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related field.
About the job
Leads development, qualification, and high-volume manufacturing scale-up of die-to-wafer hybrid bonding technology for advanced packaging.
What you'll do
- Define the hybrid bonding roadmap and targets for pitch scaling, alignment, yield, defects, and reliability.
- Lead process and first-of-a-kind equipment/platform development, addressing yield and reliability issues through qualification and manufacturing ramp.
- Collaborate with suppliers and cross-functional teams, and mentor technical leaders to deliver scalable solutions.
What they ask for
- Deep expertise in hybrid bonding, wafer bonding, or advanced packaging module development.
- Industry experience in hybrid bonding equipment and process development, process optimization, yield improvement, and reliability enhancement.
- Experience developing first-of-a-kind platforms or equipment and scaling to high-volume manufacturing; experience with qualification, ramp, or production transfer.
- Bachelor's degree + 15+ years of experience, or Master's degree + 10+ years of experience, or PhD + 8+ years of experience.
Nice to have
- Track record delivering first-of-a-kind hybrid bonding platforms into HVM and improving yield, reliability, and manufacturability.
- Experience with chiplets, 2.5D/3D integration, equipment-process co-optimization, or supplier engagement.
Pay
$211,400.00-298,440.00 USD (annual salary; base salary or total pay not specified)
AI focus
Enables advanced packaging technologies for high-performance computing, AI, and chiplet architectures; no direct AI development work is stated.
Model-written summary · the original posting is authoritative