Intel
Process Integration and Yield Technician
$52K–$100K
US, Arizona, Phoenix · Full-time · Posted Oct 12, 2026
- Experience
- 1+ years of hands-on project experience on a scientific topic.
- Education
- Associate degree or Bachelor's degree in Material Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering or related fields of study.
About the job
Conducts electrical and physical failure analysis to identify failures and understand root causes in advanced electronic packaging technologies, while supporting materials and assembly process development.
What you'll do
- Set up, operate, and maintain laboratory instruments; conduct experiments and document observations and results.
- Conduct electrical and physical failure analysis to support root-cause understanding of new package technologies.
- Develop conclusions from laboratory findings and support package material and assembly process development.
What they ask for
- Associate degree or Bachelor's degree in Material Science Engineering, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or a related field.
- Familiarity with basic scientific principles and some laboratory experience.
- 1+ years of hands-on project experience on a scientific topic.
Nice to have
- Prior experience with electrical failure analysis, mechanical polisher, optical microscope, or electron microscopy.
- Some understanding of packaging material property and behavior.
Pay
$51,710.00-99,770.00 USD (hourly role; annual salary range)
Tools
mechanical polisher, optical microscope, electron microscopy
Model-written summary · the original posting is authoritative