Drimva

Intel

Process Integration and Yield Technician

$60K–$85K

US, Arizona, Phoenix · Full-time · Posted Oct 8, 2026

Experience
Associate degree route: 4+ years; bachelor’s degree route: 2+ years, in hands-on laboratory or manufacturing experience in a semiconductor, high-tech manufacturing, engineering, or related technical environment.
Education
Associate or bachelor’s degree in Materials Science, Mechanical Engineering, Semiconductor Manufacturing, or another STEM-related field.
Visa sponsorship
Not eligible for Intel immigration sponsorship

About the job

Supports semiconductor process optimization and yield improvement by analyzing defects and failures, conducting experiments, and collaborating on quality and reliability initiatives.

What you'll do

  • Analyze defects and product failures using physical, electrical, and technical methods; identify root causes and characterize defects.
  • Collect and interpret manufacturing and reliability data, conduct engineering experiments, and report findings and recommendations.
  • Maintain and troubleshoot laboratory equipment and work with engineering and manufacturing teams on corrective and preventive actions.

What they ask for

  • Associate degree in a STEM-related field and 4+ years of relevant hands-on laboratory or manufacturing experience, or a bachelor’s degree in a STEM-related field and 2+ years of such experience.
  • Willingness to stand and walk for up to 80% of the workday.
  • Ability and willingness to perform precision manual work, including soldering small components and fine polishing.

Nice to have

  • 3+ years in a semiconductor manufacturing or lab facility.
  • 1+ years in acoustic imaging, x-ray inspection, electron spectroscopy and imaging (SEM/TEM/EDX), or sample preparation; familiarity with laboratory techniques.

Pay

$60,450.00-85,340.00 USD (hourly role; annual salary range)

Tools

Scanning Electron Microscopy (SEM), SEM/TEM/EDX

Model-written summary · the original posting is authoritative

First seen Oct 10, 2026 · Last verified Nov 4, 2026 (UTC)