Intel
Quantum Packaging Thermal Architect
$142K–$200K
US, Oregon, Hillsboro · Full-time · Posted Sep 23, 2026
- Experience
- M.S. route: 5+ years in thermal modeling and simulation for packaging or related hardware. Ph.D. route: academic or work experience in related areas. Preferred: 2+ years in thermal/mechanical cryogenic packaging modeling and simulation.
- Education
- M.S. in Electrical Engineering, Physics, or related field; OR Ph.D. in Electrical Engineering, Physics, or related field.
About the job
Models and simulates thermal behavior in quantum-computing packaging hardware and coordinates packaging integration and co-design with multidisciplinary stakeholders.
What you'll do
- Model and simulate heat flow through packaging hardware, from silicon test chips to heat spreaders.
- Manage packaging hardware integration and enable co-design with stakeholders and mechanical designers.
- Share design milestones through presentations and documentation; keep up with packaging developments.
What they ask for
- M.S. in Electrical Engineering, Physics, or a related field and 5+ years of relevant thermal modeling and simulation experience, or a Ph.D. in those fields with academic or work experience in related areas.
- Experience in thermal/mechanical modeling, simulation, and optimization using software such as Ansys Icepak or COMSOL.
- Understanding of packaging technologies and thermal integration.
Nice to have
- 2+ years of thermal/mechanical cryogenic packaging modeling and simulation experience.
Pay
$141,910.00-200,340.00 USD (annual target compensation; base salary or total pay not specified)
Tools
Ansys Icepak, COMSOL
Model-written summary · the original posting is authoritative