Intel
Senior Thin Films Metals Deposition Engineer
$134K–$255K
US, Oregon, Hillsboro · Senior · Full-time · Posted Sep 30, 2026
- Experience
- 6+ years relevant experience; 4+ years direct metals deposition module experience; 3+ years with one or more specified deposition technologies.
- Education
- Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
About the job
Leads metals deposition process readiness, optimization, problem-solving, and transfer into high-volume manufacturing across advanced Intel technology nodes.
What you'll do
- Drive data-based root-cause analysis and resolve deposition and manufacturing challenges across technology development and manufacturing teams.
- Develop strategies and coordinate stakeholders to improve process performance, yield, and timely delivery.
- Support metals deposition process readiness and ramp from early development through high-volume manufacturing.
What they ask for
- Master's degree in a related engineering or science field.
- 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
- 4+ years of direct experience in metals deposition modules.
- Hands-on thin-film deposition experience in a stated semiconductor area and 3+ years with PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks.
Nice to have
- Ph.D. in a related engineering or science field.
- Experience with advanced technology nodes, process transfer to HVM, or metals deposition equipment ownership.
Pay
$133,800.00-255,200.00 USD (target compensation; salary type not specified)
Tools
PVD, CVD, ALD, CMP
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