Intel
Silicon Packaging Design Architect
$164K–$312K
US, Arizona, Phoenix · Full-time · Posted Oct 6, 2026
- Experience
- Degree-dependent alternatives: 6+ years with a bachelor’s degree, 4+ years with a master’s degree, or 2+ years with a Ph.D.; additionally, 2+ years of hands-on semiconductor fabrication, chip assembly, or packaging experience. Preferred: 10+ years in Package, PCB design, or IC digital design.
- Education
- Bachelor’s, master’s, or Ph.D. in electrical engineering, mechanical engineering, chemical engineering, materials science, or a STEM-related field.
- Visa sponsorship
- US citizenship required.
About the job
Drives end-to-end silicon package architecture and development, balancing physical, electrical, thermal, reliability, and cost requirements while coordinating design-to-production work across teams.
What you'll do
- Translate product requirements into package architecture specifications and make technology tradeoffs.
- Oversee package development, troubleshoot design and process issues, and improve quality standards.
- Collaborate with silicon, hardware, board, package, and EDA teams to optimize package solutions and design methods.
What they ask for
- US citizenship and ability to obtain and maintain a US Government TS/SCI Security Clearance with Polygraph.
- Bachelor’s degree in a listed engineering or STEM field with 6+ years, master’s with 4+ years, or Ph.D. with 2+ years.
- 2+ years of hands-on experience in semiconductor fabrication, chip assembly, or packaging.
- Experience with electromagnetic simulation tools and Cadence Allegro and/or Mentor Xpedition platform tools; in-depth knowledge of assembly processes, test methodologies, and characterization techniques.
Nice to have
- Active US Government TS/SCI Security Clearance with Polygraph.
- 10+ years of experience with profound knowledge in Package, PCB design, or IC digital design; packaging optimization experience is also preferred.
Pay
$164,470.00-311,890.00 USD (base salary)
Tools
Mentor, Cadence, SPICE, Ansys, Cadence Allegro, PCB Editor, Advanced Package Designer, Mentor Xpedition
Model-written summary · the original posting is authoritative