Intel
Staff EMIB-T Substrate Yield Engineer
$181K–$255K
US, Arizona, Phoenix +2 · Staff · Full-time · Posted Oct 5, 2026
- Location
- US, Arizona, Phoenix
US, New Mexico, Albuquerque
US, Oregon, Hillsboro - Experience
- Bachelor's: 8+ years; master's: 6+ years; PhD: 4+ years. Also requires 5+ years in a relevant semiconductor or related field.
- Education
- Bachelor's, master's, or PhD in Engineering, Materials Science, Physics, Chemistry, Data Science, or a related technical discipline.
- Visa sponsorship
- Not eligible for Intel immigration sponsorship.
About the job
Leads supplier yield improvement, defect reduction, technical issue resolution, and process-control maturity for next-generation EMIB-T substrates across Japan suppliers.
What you'll do
- Own supplier-line yield performance and drive technical issues from investigation through corrective action and sustainment.
- Use statistical and spatial analytics to identify defect patterns and establish supplier actions, control limits, and verification plans.
- Support DFM/DFY, qualification, manufacturing ramp readiness, change control, and deployment of dashboards or automated analytics.
What they ask for
- Bachelor's degree and 8+ years, master's degree and 6+ years, or PhD and 4+ years in a relevant technical discipline.
- 5+ years in semiconductor manufacturing, advanced packaging, substrate technology, yield engineering, process engineering, or a closely related field.
- Hands-on yield engineering experience including statistical analysis, defect reduction, process optimization, SPC, DFM/DFY, defect metrology, failure analysis, and HVM execution.
- Experience developing or deploying yield monitoring systems, automated analytics, dashboards, image analytics, computer vision, AI/ML-based defect detection, or automated defect classification systems.
Nice to have
- Experience working directly with substrate suppliers and external manufacturing partners.
- Program leadership or experience with advanced packaging processes, technology development, qualification, or manufacturing ramp.
Pay
$180,770.00-255,200.00 USD (base salary)
Tools
EMIB-T, SPC, DFM/DFY, AI/ML, TSV, 2.5D/3D packaging, computer vision, semi-additive processing
AI focus
Experience developing or deploying AI/ML-based defect detection and related automated defect classification or analytics systems.
Model-written summary · the original posting is authoritative