Intel
TD Media and Collaterals Development Engineer
$85K–$120K
US, Arizona, Phoenix · Full-time · Posted Sep 24, 2026
- Experience
- 6 months of hands-on experience; experience in equipment engineering, mechanical design, and/or process engineering.
- Education
- Bachelor's degree in mechanical engineering or a related field.
- Visa sponsorship
- Not eligible for Intel immigration sponsorship
About the job
Develops and optimizes assembly media and collaterals to improve reliability, manufacturability, cost efficiency, and semiconductor packaging processes.
What you'll do
- Develop and optimize media and collaterals for quality, reliability, cost, yield, and productivity targets.
- Design and implement solutions using statistical methods, and evaluate them under simulated field conditions.
- Identify and mitigate quality and reliability risks; document technical improvements in research papers and presentations.
What they ask for
- Bachelor's degree in mechanical engineering or a related field.
- At least 6 months of hands-on experience in equipment engineering, mechanical design, and/or process engineering.
Nice to have
- Experience with SolidWorks or AutoCAD; portfolio of self-completed projects from concept to fabrication.
- Familiarity with semiconductor packaging processes and technology.
Pay
$85,200.00-120,280.00 USD (base salary)
Tools
Design of Experiments (DOE), Statistical Process Control (SPC), SolidWorks, AutoCAD
Model-written summary · the original posting is authoritative