Intel
Thermal Analysis Engineer
$164K–$232K
US, Arizona, Phoenix · Full-time · Posted Sep 30, 2026
- Experience
- 6+ years with a bachelor’s degree, 4+ years with a master’s degree, or 2+ years with a PhD.
- Education
- Bachelor's or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
About the job
Conduct semiconductor research and develop, simulate, fabricate, and test advanced packaging and interconnect technologies.
What you'll do
- Research device physics, thermomechanical analysis, materials science, and process innovations.
- Design and fabricate prototypes; perform electrical testing and develop device-characterization methods.
- Plan experiments and develop models and measurements with internal teams and external collaborators.
What they ask for
- Bachelor’s or BS degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field.
- 6+ years of experience with a bachelor’s degree, 4+ years with a master’s degree, or 2+ years with a PhD.
- Advanced experience in semiconductor fabrication processes and packaging design methodologies.
- Advanced experience with finite element analysis and computational fluid dynamics simulation tools, and Python or MATLAB; hands-on lab testing and data analysis experience.
Nice to have
- Experience with advanced packaging technologies, including EMIB and Foveros architectures.
- Expertise in Design of Experiments (DOE), statistical analysis, and model-based problem-solving; familiarity with materials characterization and external research collaborations.
Pay
$164,470.00-232,190.00 USD (annual salary range; base salary or total pay not specified)
Tools
Ansys, Abaqus, Python, MATLAB, EMIB, Foveros, DC, RF
Model-written summary · the original posting is authoritative