Intel
Thin Films Module Development Engineer
$156K–$255K
US, Oregon, Hillsboro · Full-time · Posted Oct 30, 2026
- Experience
- 6+ years with a bachelor’s degree, 4+ years with a master’s degree, or 2+ years with a Ph.D.
- Education
- Bachelor’s, master’s, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related STEM field.
- Visa sponsorship
- See Intel U.S. Immigration Sponsorship Information for immigration sponsorship guidelines.
About the job
Develop and deliver metals modules for advanced semiconductor technologies by combining hardware knowledge and process expertise to meet program needs.
What you'll do
- Develop metals modules within hardware capabilities and program process requirements.
- Formulate technical problem statements, establish roadmaps and timelines, and lead with data.
- Partner with stakeholders to deliver results on time.
What they ask for
- Bachelor’s degree in a listed or related STEM field with 6+ years of experience, or master’s degree with 4+ years, or Ph.D. with 2+ years.
- Experience in semiconductor manufacturing or process development.
- Experience in one or more of: process optimization and defect reduction; DOE, SPC, and structured problem-solving; dry etch, material science, and equipment metrology; or semiconductor equipment and supplier collaboration.
Nice to have
- Doctoral degree in a relevant field; experience with sub-10nm nodes or FinFET/GAA architectures.
- Technology Development and High Volume Manufacturing process solutions; cross-functional leadership, mentoring, or technical guidance.
Pay
$155,520.00-255,200.00 USD annual base salary
Tools
Design of Experiments (DOE), Statistical Process Control (SPC), dry etch, FinFET, Gate-All-Around (GAA)
Model-written summary · the original posting is authoritative