Intel
Thin Films Module Development Engineer
$134K–$189K
US, Oregon, Hillsboro · Full-time · Posted Aug 21, 2026
- Experience
- At least 1 year of experience in the specified areas; requirements may be met through a combination of industry experience, internships, or schoolwork/classes/research.
- Education
- PhD in a listed or closely related STEM field.
- Visa sponsorship
- The posting refers candidates to Intel’s U.S. immigration sponsorship guidelines but does not state a specific visa policy.
About the job
Develops and optimizes thin-film metal deposition processes for advanced semiconductor technologies, supporting device performance, yield, and manufacturing readiness.
What you'll do
- Develop, define, and optimize metal deposition processes across deposition platforms.
- Design and analyze experiments to meet device requirements and improve yield.
- Evaluate materials and equipment, qualify new equipment, and collaborate with cross-functional teams on technology development.
What they ask for
- PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, or a closely related STEM field.
- Working knowledge of one or more thin-film deposition technologies.
- Ability to analyze process data using statistical methods, structured troubleshooting, and robust experimental design.
Nice to have
- Thin-film metal deposition development, materials characterization/metrology, or semiconductor device experience.
- Experience with JMP, Excel, Python, R, SQL, or AI-assisted engineering tools.
Pay
$133,800.00-188,890.00 USD annual salary range (base salary)
Tools
ALD, CVD, PVD, sputtering, evaporation, electrochemical deposition, JMP, Python
AI focus
Experience using AI-assisted engineering tools to improve technical productivity while maintaining independent engineering judgment is preferred.
Model-written summary · the original posting is authoritative