Drimva

K2 Space

Principal ASIC Package Design Engineer

$200K–$280K

Seattle, WA +1 · Principal · Full-time · Posted Sep 15, 2026

Location
Seattle, WA
Seattle, Washington, United States
Experience
10+ years in ASIC package design.
Education
Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
Visa sponsorship
Must be a “U.S. person” as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license.

About the job

Leads end-to-end ASIC package architecture and execution for high-performance mixed-signal and digital SoCs, from early design through vendor qualification and production ramp.

What you'll do

  • Own FC-BGA and MCM package architecture, including substrate stack-up, ball maps, power delivery, signal breakout, and mechanical constraints.
  • Lead package-level SI/PI, thermal, reliability, manufacturability, and cost trade studies; define design standards and roadmap.
  • Manage packaging vendors and suppliers, qualification, material selection, and assembly-process optimization.

What they ask for

  • Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 10+ years of ASIC package design experience, with deep expertise in FC-BGA.
  • Proven delivery of high-pin-count, high-performance ASIC packages into production; experience working directly with OSATs and substrate vendors.
  • Strong knowledge of substrate technologies and materials, package-level SI/PI, thermal management, qualification and test methodologies; fluency with SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.

Nice to have

  • Experience with MCM or heterogeneous integration, such as chiplets, interposers, or advanced laminates.
  • Background in high-speed digital or mixed-signal SoCs, aerospace/space/high-reliability electronics, or scaling package design methodology.

Pay

$200,000 – $280,000 USD base salary

Tools

FC-BGA, MCM, SerDes, JESD, Interlaken, SIWave, HFSS, ADS

Model-written summary · the original posting is authoritative

First seen Oct 29, 2026 · Last verified Nov 5, 2026 (UTC)