Drimva

K2 Space

Principal ASIC Package Design Engineer

$200K–$280K

United States - Remote +1 · Remote · Principal · Full-time · Posted Sep 15, 2026

Location
United States - Remote
Los Angeles
Experience
10+ years in ASIC package design.
Education
Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
Visa sponsorship
Must be a “U.S. person” as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license.

About the job

Leads end-to-end ASIC package architecture and execution for high-performance mixed-signal and digital SoCs, from early design through vendor qualification and production ramp.

What you'll do

  • Own FC-BGA and MCM package architecture, including substrate stack-ups, ball maps, power delivery, signal breakout, and mechanical constraints.
  • Lead package trade studies and SI/PI, thermal, reliability, manufacturability, and material decisions; establish package design standards and roadmap.
  • Coordinate with silicon, RF, systems, packaging vendors, substrate suppliers, and OSATs through qualification and production ramp.

What they ask for

  • Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
  • 10+ years of experience in ASIC package design, with deep expertise in FC-BGA.
  • Proven experience delivering high-pin-count, high-performance ASIC packages into production.
  • Experience with OSATs and substrate vendors; knowledge of package SI/PI, substrate technologies, thermal management, and packaging qualification and test methodologies.

Nice to have

  • Experience with MCM or heterogeneous integration, such as chiplets, interposers, or advanced laminates.
  • Background in high-speed digital or mixed-signal SoCs; aerospace, space, or high-reliability electronics; or packaging strategy and methodology development.

Pay

$200,000 – $280,000 USD base salary

Tools

FC-BGA, MCM, SIWave, HFSS, ADS, SerDes, JESD, Interlaken

Model-written summary · the original posting is authoritative

First seen Oct 29, 2026 · Last verified Nov 5, 2026 (UTC)