Drimva

K2 Space

Principal ASIC Physical Design Engineer

$190K–$280K

Seattle, WA +1 · Principal · Full-time · Posted Jun 30, 2026

Location
Seattle, WA
Seattle, Washington, United States
Experience
10+ years in ASIC physical design for high-performance SoCs.
Education
Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
Visa sponsorship
Must be a “U.S. person” as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license.

About the job

Leads end-to-end physical design of advanced SoCs for satellite and space systems, from RTL handoff through GDSII sign-off and production support.

What you'll do

  • Own RTL-to-GDSII implementation, including synthesis, floorplanning, place and route, CTS, STA, physical verification, and sign-off.
  • Develop physical-design methodologies and automation, drive timing closure and PPA optimization, and coordinate with design, packaging, test, and EDA teams.
  • Guide external design partners and support chip bring-up, production, and spaceflight.

What they ask for

  • Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
  • 10+ years of ASIC physical design experience for high-performance SoCs.
  • End-to-end RTL-to-GDSII expertise using Synopsys, Cadence, or Siemens tools; hands-on timing closure, IR drop analysis, and ECO implementation.
  • Experience with advanced FinFET nodes, multi-clock/multi-voltage/hierarchical SoCs, and managing or coordinating outsourced physical-design teams or vendors.

Nice to have

  • Exposure to radiation-hardened or space-qualified ASICs; chip-package co-design or advanced packaging.
  • Experience driving tapeouts through TSMC or with Gate-All-Around technologies.

Pay

$190,000 – $280,000 USD base salary

Tools

Synopsys, Cadence, Siemens, FinFET, UPF/CPF, TSMC, Gate-All-Around, GDSII

Model-written summary · the original posting is authoritative

First seen Oct 29, 2026 · Last verified Nov 5, 2026 (UTC)