K2 Space
Senior ASIC Package Design Engineer
$180K–$260K
United States - Remote · Remote · Senior · Full-time · Posted Sep 15, 2026
- Experience
- 5+ years of experience in ASIC package design.
- Education
- Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
- Visa sponsorship
- Must be a “U.S. person” as defined by ITAR or otherwise eligible for a federally issued export control license.
About the job
Design and deliver advanced FC-BGA and MCM packages for high-performance ASICs, from architecture and trade studies through vendor qualification and production.
What you'll do
- Define package architecture, stack-ups, ball maps, routing, power delivery, and mechanical constraints; lead cost, performance, SI/PI, thermal, manufacturability, and reliability trade studies.
- Drive package design standards and detailed FC-BGA design, collaborating with silicon, RF, and systems teams to optimize die and package interfaces.
- Lead package thermal architecture and manage packaging vendors, substrate suppliers, and OSATs through material selection and assembly optimization.
What they ask for
- Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
- 5+ years of experience in ASIC package design, with deep expertise in FC-BGA.
- Proven experience delivering high-pin-count, high-performance ASIC packages into production.
- Strong understanding of substrate technologies and materials, package-level SI/PI, thermal management, SI/PI and EM simulation tools such as SIWave, HFSS, and ADS; experience with OSATs and substrate vendors.
Nice to have
- Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates); background in high-speed digital or mixed-signal SoCs.
- Familiarity with aerospace, space, or high-reliability electronics.
Pay
$180,000 – $260,000 USD base salary
Tools
FC-BGA, MCM, SIWave, HFSS, ADS, OSATs
Model-written summary · the original posting is authoritative