Lightmatter
Package Layout Engineer
$157K–$176K
Mountain View, CA · Full-time · Posted Aug 19, 2026
- Experience
- At least 5 years of relevant experience; minimum 3–5 years of IC package layout design experience.
- Education
- B.S. or M.S. degree in Electrical Engineering or similar discipline.
- Visa sponsorship
- Candidates should have capacity to comply with the federally mandated requirements of U.S. export control laws.
About the job
Design and deliver IC package substrate layouts for advanced products, optimizing package architecture and ensuring signal, power, thermal, mechanical, and manufacturing requirements are met.
What you'll do
- Create substrate layouts and preliminary floorplans, including stack-up optimization.
- Coordinate with suppliers, OSATs, and internal teams on design rules, manufacturing and assembly closure, and package tape-outs.
- Support signal/power integrity iterations and improve design automation and verification.
What they ask for
- B.S. or M.S. degree in Electrical Engineering or similar discipline.
- At least 5 years of relevant experience, including 3–5 years in IC package layout design.
- Proficient with Allegro X APD.
- Understanding of IC package substrates and organic materials and their impact on package design.
Nice to have
- Familiarity with Cadence Integrity 3DIC or other listed layout tools; experience with SKILL or Python scripting.
- Experience or interest in advanced packaging architectures, physical feasibility studies, floorplans, routing, bump patterns, or D2D topologies.
Pay
$157,000 — $176,000 USD (total compensation; base salary range not specified)
Tools
Allegro X APD, Cadence Integrity 3DIC, Expedition Package Designer, Pads Layout, Altium, SKILL, Python
AI focus
Supports package layouts for products serving AI and HPC data centers; no AI-specific work is stated.
Model-written summary · the original posting is authoritative