Meta
ASIC Package Engineer
$178K–$250K
Sunnyvale, CA +1 · Full-time · Posted Oct 22, 2026
- Location
- Sunnyvale, CA
Austin, TX - Experience
- 8+ years; willingness to travel internationally, typically once per quarter.
- Education
- Bachelor's degree in Computer Science, Computer Engineering, a relevant technical field, or equivalent practical experience; master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field, or equivalent practical experience. The posting also lists a master's degree or PhD in Materials Science, Mechanical Engineering, or a related discipline.
About the job
Owns development, qualification, and yield improvement of package-to-board attach processes for Meta’s large-body advanced ASIC packages.
What you'll do
- Characterize and mitigate package warpage and coplanarity, and develop board-level reliability strategies and test plans.
- Define package-board process specifications, design rules, and manufacturing controls; drive qualification, supplier engagement, and yield improvement.
- Collaborate with quality, package, module, and system teams on co-design, design reviews, qualification, and manufacturing readiness.
What they ask for
- 8+ years of semiconductor packaging experience with direct ownership of package-to-board assembly and reliability, or a package-board process engineering or electronics manufacturing background.
- Experience with package-board processes such as solder paste printing, pick-and-place, reflow soldering, and inspection.
- Experience with assembly and ODM suppliers, process qualification and yield improvement, and solder-joint failure analysis.
- Experience with quality engineering collaboration, statistical process control, process capability analysis, and Design of Experiments.
Nice to have
- Experience with AI/HPC or networking hardware at data-center scale.
- Experience with large-body FCBGA, flip-chip, and 2.5D/3D packages, or high-temperature warpage characterization and thermo-mechanical or finite element modeling.
Pay
$178,000/year to $250,000/year (base salary)
Tools
SPI, AOI, X-ray, FEM, FCBGA, 2.5D/3D, SPC, DOE
AI focus
Supports packaging technology for Meta's custom AI/ML silicon and next-generation AI/ML products.
Model-written summary · the original posting is authoritative