Meta
Silicon Packaging Engineer
$146K–$209K
Sunnyvale, CA · Full-time · Posted Oct 26, 2026
- Experience
- 8+ years in semiconductor packaging; no alternative stated.
- Education
- Bachelor's degree in Computer Science, Computer Engineering, or a relevant technical field, or equivalent practical experience. The posting also lists a Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field, or equivalent practical experience; it later lists a Master's degree or PhD in Materials Science, Mechanical Engineering, or a related discipline.
About the job
Develops and integrates advanced semiconductor packaging for Meta’s AI/ML and networking infrastructure hardware, from design and technology development through manufacturing and product qualification.
What you'll do
- Design and analyze single-chip, multi-chip, and SiP/module packages, including novel 2.5D/3D and heterogeneous integration approaches.
- Lead advanced packaging technology development from concept to product, coordinating with internal teams and external manufacturing and ecosystem partners.
- Support package and system co-design, design reviews, design-of-experiments, partner qualification, and integration into product development.
What they ask for
- 8+ years of semiconductor packaging experience with direct ownership of advanced packaging development, assembly processes, and manufacturing.
- In-depth knowledge of flip chip, 2.5D, and 3D packaging technologies.
- Experience taking products from concept to production, including manufacturing specifications, vendor qualifications, and manufacturing efficiency and cost improvements.
- Bachelor's degree in Computer Science, Computer Engineering, or a relevant technical field, or equivalent practical experience.
Nice to have
- Hands-on interposer or fanout package design experience, including organic and inorganic interposers and bridge options.
- Master's degree or PhD in Materials Science, Mechanical Engineering, or a related discipline.
Pay
$146,000/year to $209,000/year USD base salary
Tools
flip chip, 2.5D, 3D, SiP, TSVs, microbumps, CoWoS-L, CoWoS-R
AI focus
Develops packaging solutions and technologies for AI/ML products and machine-learning infrastructure hardware.
Model-written summary · the original posting is authoritative