Micron
Design Lead (HBM/Advanced Memory Design)
Richardson, TX · Full-time · Posted Sep 29, 2026
- Experience
- 20+ years of semiconductor design experience (adjust per internal leveling guidelines).
- Education
- BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.
About the job
Leads architecture, design, integration, and delivery of next-generation HBM and advanced memory products, coordinating teams through silicon development and bring-up.
What you'll do
- Lead complex memory subsystem design, top-level integration, technical planning, and schedule execution.
- Coordinate design, verification, layout, DFT, product engineering, and technology teams; lead reviews and resolve issues.
- Support silicon bring-up, debug, characterization, and yield improvement; mentor engineers and improve methodologies using AI-enabled tools and automation.
What they ask for
- BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.
- 20+ years of semiconductor design experience (adjust per internal leveling guidelines).
- Demonstrated experience leading complex IC development programs.
- Strong understanding of digital and/or custom circuit design methodologies, with experience in RTL design, timing closure, verification/debug, DFT, silicon validation, and power, performance, and area optimization.
Nice to have
- Experience with DRAM, DDR, HBM, LPDDR, or advanced memory products.
- Experience leading global multi-functional teams; knowledge of advanced process nodes, design-for-manufacturing, implementation flows, advanced packaging, or product tape-outs.
Tools
Verilog, SystemVerilog, Synopsys, Cadence, TSV
AI focus
Define and improve design methodologies applying AI-enabled tools, automation, and protocols.
Model-written summary · the original posting is authoritative