Micron
Design Lead (HBM/Advanced Memory Design)
Richardson, TX · Full-time · Posted Sep 29, 2026
- Experience
- 10+ years of semiconductor design experience (adjust per internal leveling guidelines).
- Education
- BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.
About the job
Leads architecture, design, integration, and execution of next-generation HBM and advanced memory products, coordinating teams to deliver high-quality silicon on schedule.
What you'll do
- Lead memory subsystem design, top-level integration, planning, technical decisions, risk assessment, and schedule execution.
- Coordinate design, verification, layout, DFT, product engineering, and technology teams; lead reviews and resolve issues.
- Guide engineers, improve design methodologies using AI-enabled tools and automation, and support silicon bring-up, debug, characterization, and yield improvement.
What they ask for
- BS/MS/PhD in Electrical Engineering, Computer Engineering, or a related field.
- 10+ years of semiconductor design experience (adjust per internal leveling guidelines).
- Demonstrated experience leading complex IC development programs.
- Strong understanding of digital and/or custom circuit design methodologies; experience with memory arrays, power delivery, verification/debug, DFT, silicon validation, and PPA/thermal optimization.
Nice to have
- Experience with DRAM, DDR, HBM, LPDDR, or advanced memory products.
- Experience with Synopsys and Cadence implementation flows.
Tools
HBM, DRAM, DDR, LPDDR, Synopsys, Cadence, TSV
AI focus
Apply AI-enabled tools, automation, and guidelines to define and improve design methodologies.
Model-written summary · the original posting is authoritative