Micron
Design Lead (HBM/Advanced Memory Design)
Richardson, TX · Full-time · Posted Sep 29, 2026
- Experience
- 15+ years of semiconductor design experience (adjust per internal leveling guidelines).
- Education
- BS/MS/PhD in Electrical Engineering, Computer Engineering, or related field.
About the job
Leads architecture, design, integration, and execution of next-generation HBM and advanced memory products, coordinating teams to deliver high-quality silicon on schedule.
What you'll do
- Lead complex memory subsystem design, top-level integration, planning, technical decisions, and schedule execution.
- Coordinate design, verification, layout, DFT, product engineering, and technology teams; drive reviews and issue resolution.
- Mentor engineers and support silicon bring-up, debug, characterization, and yield improvement.
What they ask for
- BS/MS/PhD in Electrical Engineering, Computer Engineering, or a related field.
- 15+ years of semiconductor design experience (adjust per internal leveling guidelines).
- Demonstrated experience leading complex IC development programs.
- Experience with RTL design (Verilog/SystemVerilog), timing closure and physical implementation, verification and debug, DFT and silicon validation, and power, performance, and area optimization.
Nice to have
- Experience with DRAM, DDR, HBM, LPDDR, or advanced memory products; global multifunctional team leadership.
- Synopsys and Cadence implementation flows; advanced process nodes, design-for-manufacturing, package integration, 2.5D/3D stacking, TSV, advanced packaging, or successful product tape-outs.
Tools
Verilog, SystemVerilog, Synopsys, Cadence, DRAM, DDR, HBM, LPDDR
AI focus
Define and improve development methodologies using AI-enabled tools and automation.
Model-written summary · the original posting is authoritative