Micron
Director / DMTS, Process Integration Lead – Advanced Packaging (2.5D/3D, HBM, Hybrid Bonding)
Boise, ID - Main Site · Director · Full-time · Posted Sep 24, 2026
- Experience
- 15+ years.
- Education
- Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field.
About the job
Leads a technical team developing, integrating, and transferring advanced 2.5D/3D packaging technologies, including HBM, from concept to full-scale manufacturing.
What you'll do
- Lead and grow a team integrating 2.5D/3D packaging, advanced interconnects, die stacking, and HBM.
- Develop, optimize, and qualify packaging processes; improve yield, reliability, and performance through analysis and validation.
- Lead technology transfer to manufacturing and collaborate across engineering teams to scale packaging solutions.
What they ask for
- Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field.
- 15+ years of experience including advanced packaging technology development, 2.5D, 3D stacking, and HBM integration.
- Experience with advanced interconnects, TSVs, die stacking, underfill, molding, bonding, and package integration processes.
- Experience with hybrid bonding (W2W/C2W), HBM-to-logic integration, thermal optimization, AI-enabled engineering workflows or AI tools, and technical team leadership.
Nice to have
- Master's degree or PhD.
- Experience scaling packaging technologies to manufacturing; expertise in yield, SPC, defect reduction, warpage, reliability, or technical publications/patents/presentations.
Tools
2.5D, 3D, HBM, TSVs, hybrid bonding, W2W/C2W, SPC, DOE
AI focus
Define AI-enabled engineering workflows, develop automation agents, or apply AI tools to semiconductor development.
Model-written summary · the original posting is authoritative