Micron
Director, Technical Package Development
Boise, ID - Main Site · Director · Full-time · Posted Sep 9, 2026
- Experience
- 15+ years of semiconductor packaging experience and 10+ years leading engineering teams, complex technology programs, or global engineering organizations.
- Education
- Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field; Master’s degree or PhD preferred.
About the job
Leads strategy, development, and execution of advanced DRAM packaging technologies and a global engineering organization across Micron’s memory portfolio.
What you'll do
- Set packaging technology strategy and lead development and deployment from concept through high-volume manufacturing.
- Build and lead a global packaging organization; partner across internal teams and external stakeholders to deliver products.
- Drive AI and digital engineering adoption, technology investment decisions, and organizational performance improvements.
What they ask for
- Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or a related technical field.
- 15+ years of semiconductor packaging experience, including delivery of advanced packaging technologies through high-volume manufacturing.
- 10+ years leading engineering teams, complex technology programs, or global engineering organizations.
- Expertise in advanced packaging technologies and experience driving business-critical technology decisions through analysis, risk assessment, and collaboration.
Nice to have
- Master’s degree or PhD in a related technical field.
- Experience implementing AI, machine learning, advanced analytics, digital engineering, or Agentic AI workflows.
Tools
HBM, LPDRAM, DDR, 2.5D/3D integration, heterogeneous integration, chiplets, AI, machine learning
AI focus
Drive adoption of AI, machine learning, advanced analytics, digital engineering, and potentially Agentic AI workflows to improve engineering, manufacturing, product development, and business outcomes.
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