Micron
DMTS Process Development Engineer, Advanced Packaging
Boise, ID - Main Site · Full-time · Posted Sep 21, 2026
- Experience
- 15+ years in semiconductor process development, manufacturing, or advanced packaging.
- Education
- MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience).
About the job
Leads advanced packaging process development for next-generation memory products, taking technologies from pathfinding through manufacturing readiness and shaping technical strategy across programs.
What you'll do
- Own wafer-level and die-level packaging processes, developing process flows, materials, and integration schemes.
- Lead first-of-a-kind development, supplier collaboration, problem-solving, and technology transfer to manufacturing.
- Guide strategic decisions and apply AI-enabled tools, automation, analytics, and modeling to improve process development.
What they ask for
- MS in Chemistry, Chemical Engineering, Materials Science, or a related field (or equivalent experience).
- 15+ years in semiconductor process development, manufacturing, or advanced packaging.
- Deep expertise in wafer-level or die-level processes, such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding.
- Strong process integration and materials-interaction knowledge, with proven leadership of complex cross-functional technical programs.
Nice to have
- PhD in a relevant technical field.
- Advanced memory or 3D packaging experience; mentoring and methodology-improvement experience; or familiarity with materials characterization and simulation.
Tools
CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing
AI focus
Use AI-enabled tools, automation, data analytics, and advanced modeling to accelerate process development, strengthen decision-making, and improve technical outcomes.
Model-written summary · the original posting is authoritative