Micron
DRAM Device & Process Integration Engineer
Boise, ID - Main Site · Full-time · Posted Oct 5, 2026
- Experience
- Semiconductor industry experience is required; no number of years stated.
- Education
- PhD or MS degree in Electrical Engineering, Physics, Materials Science, or a related technical field.
About the job
Own front-end process integration for future DRAM technology nodes, using silicon experiments and device/process modeling to guide development and transfer technology from R&D to manufacturing.
What you'll do
- Own DRAM FEOL integration schemes and module interactions, and deliver technology milestones.
- Design and analyze silicon DOEs and process, device, yield, and parametric data to resolve root causes.
- Use and validate modeling against silicon data, collaborate across engineering teams, and support manufacturing transfer.
What they ask for
- PhD or MS in Electrical Engineering, Physics, Materials Science, or a related technical field, plus semiconductor industry experience.
- Experience in semiconductor process integration or development, including module ownership and silicon-based problem solving.
- Working knowledge of semiconductor device physics and hands-on experience with process/device modeling or simulation tools applied to real problems.
- Experience correlating simulations or analytical results with experimental or silicon data; proficiency in data analysis, DOE, and statistical techniques.
Nice to have
- PhD in a related technical field; experience in memory, logic, analog, RF, power, sensor, MEMS, or advanced-node integration.
- Experience developing predictive models or transferring technology from R&D to manufacturing.
Tools
TCAD, Silvaco, Sentaurus
AI focus
Develops memory technology critical for AI-enabled customers; AI is not described as a job task.
Model-written summary · the original posting is authoritative