Micron
Dry Etch Module Technical Staff- MTS/SMTS
Boise, ID - ID1 · Staff · Full-time · Posted Sep 17, 2026
- Experience
- Minimum 10 years of hands-on experience in Dry Etch process development; preferably in DRAM or advanced memory technologies.
- Education
- Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
About the job
Leads the development and optimization of Dry Etch processes for advanced DRAM structures, supporting technology scaling, manufacturability, and yield improvement.
What you'll do
- Develop, characterize, and optimize Dry Etch processes; evaluate new etch technologies, chemistries, and hardware.
- Set technical roadmaps and lead cross-functional process projects, root-cause analysis, and continuous improvement.
- Mentor engineers and present technical findings to leadership and global teams.
What they ask for
- Ph.D. or Master’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
- Minimum 10 years of hands-on Dry Etch process development experience, preferably in DRAM or advanced memory technologies.
- Technical leadership experience in semiconductor process engineering; deep understanding of plasma etch mechanisms, process control, and defect mitigation.
- Experience with advanced etch tools (e.g., Lam, TEL, AMAT) and process characterization techniques.
Nice to have
- Experience with high aspect ratio etching, critical dimension control, and selectivity challenges in DRAM; knowledge of integration challenges in sub-20nm DRAM nodes.
- Familiarity with data analytics, DOE methodologies, and SPC tools; experience and/or interest in developing Agentic AI workflows.
Tools
Dry Etch, Lam, TEL, AMAT, DOE, SPC, Agentic AI
AI focus
Preferred experience and/or interest in developing Agentic AI workflows into current or future processes.
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