Micron
Engineer, Advanced Packaging Development - Design Enablement & Layout
Boise, ID - Main Site · Full-time · Posted Oct 14, 2026
- Experience
- 2+ years in the semiconductor industry.
- Education
- BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or related field.
About the job
Develops design rules, layouts, test structures, and evaluation methods for advanced packaging technology, using data and AI to accelerate development.
What you'll do
- Develop design rules, requirements, test structures, and layout designs for advanced packaging; ensure robust design rule checks.
- Analyze datasets and manage structure evaluations to quantify process margins and guide development decisions.
- Partner across teams to resolve layout-related process issues, document solutions, and align design rules across nodes.
What they ask for
- BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or a related field.
- 2+ years of semiconductor industry experience in a listed area such as Process Integration, Yield Enhancement, Product Engineering, Design, Test Structure Development, or Unit Process Development.
- Understanding of semiconductor memory process flows and TSV-based packaging; hands-on proficiency with EDA tools.
- Familiarity with Design Rule Characterization and silicon validation; proficiency in Python, R, or MATLAB.
Nice to have
- Experience coding in SKILL or SVRF.
- AI Agentic Workflow or AI tool usage in layout design.
Tools
Cadence Virtuoso Layout and Schematic Editor, Calibre, Hspice, Python, R, MATLAB, SKILL, SVRF
AI focus
Leverage artificial intelligence to reduce development time; nice-to-haves include AI Agentic Workflow and AI tool usage in layout design.
Model-written summary · the original posting is authoritative