Micron
Equipment Development Engineer – Wafer Bonding - Technology Development Group
Boise, ID - Main Site · Full-time · Posted Oct 12, 2026
- Experience
- 4+ years; semiconductor equipment, process, manufacturing, or related engineering experience.
- Education
- Bachelor’s degree in Mechanical Engineering, Robotics, Mechatronics, Controls Engineering, Materials Science, Physics, or a related technical field.
About the job
Develop next-generation wafer bonding equipment and subsystems, from concept through qualification and manufacturing implementation, to improve equipment performance and capability.
What you'll do
- Lead first-of-a-kind equipment and subsystem development with suppliers; evaluate, qualify, install, and improve hardware.
- Improve overlay, alignment, bond-wave behavior, tool matching, defectivity, contamination control, reliability, and equipment stability.
- Develop requirements, experiments, simulations, and data-driven solutions; use AI-enabled workflows for monitoring, troubleshooting, and analysis.
What they ask for
- Bachelor’s degree in a related technical field.
- 4+ years of semiconductor equipment, process, manufacturing, or related engineering experience.
- Ability to troubleshoot complex equipment, analyze data, work across engineering disciplines, and drive projects to completion.
Nice to have
- Experience with wafer-to-wafer fusion or hybrid bonding, precision alignment and overlay, motion control, or semiconductor equipment development.
- Python or MATLAB; equipment data and SECS/GEM; sensors and automation; FEA, DOE, PCA, or other modeling techniques; or supplier development experience.
Tools
Python, MATLAB, SECS/GEM, FEA, DOE, PCA
AI focus
Use AI-enabled workflows and tools for equipment monitoring, troubleshooting, data analysis, and technical problem solving to improve system performance and engineering productivity.
Model-written summary · the original posting is authoritative