Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

What you'll do

• Lead cross-site integration projects and coordinate design, test, yield, and manufacturing data through resolution.
• Develop yield improvements and packaging-readiness strategies while balancing reliability requirements.
• Lead global task forces to resolve yield and quality issues and deploy standardized methods and processes.

What they ask for

• Bachelor’s or Master’s in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
• 4+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
• Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
• Ability to analyze data, debug technical problems, communicate effectively, work independently across teams, manage multiple priorities, and travel 20–50%.

Nice to have

• Experience with DRAM High Bandwidth Memory (HBM) products or advanced DRAM technologies, packaging, chip-package interaction, BEOL integration, or layout.
• Experience collaborating across product teams or driving alignment in central or network-level roles; interest in developing Agentic AI workflows.

Tools

DRAM, HBM, HPM, BEOL

AI focus

Preferred experience and/or interest in developing Agentic AI workflows into current or future processes.