Micron
Front End Central Product Integration (FE cPIE) MTS (FE)
Boise, ID - ID1 · Full-time · Posted Aug 4, 2026
- Experience
- 7+ years in semiconductor process engineering, process integration, or a related technical role.
- Education
- Bachelor's, Master's, or PhD degree in a listed engineering or science field, or a related field.
About the job
Leads semiconductor process integration efforts to improve structural uniformity, yield, quality, reliability, and manufacturing performance across technology nodes.
What you'll do
- Develop and implement solutions for process integration and structural uniformity challenges, using modeling and root-cause analysis.
- Define and improve inline monitoring and process-control strategies; use data to resolve manufacturing issues and reduce variation.
- Lead cross-functional and global projects to develop, standardize, and scale integration practices and technology-ramp solutions.
What they ask for
- Bachelor's, Master's, or PhD degree in Electrical Engineering, Materials Engineering, Materials Science, Physics, Chemical Engineering, or a related field.
- 7+ years of experience in semiconductor process engineering, process integration, or a related technical role.
- Strong understanding of semiconductor manufacturing process flows and process interactions.
- Experience analyzing process changes' impact on yield, device performance, and product reliability; data analysis and structured problem-solving experience; knowledge of DRAM, NAND, or related semiconductor technologies.
Nice to have
- Experience leading cross-functional technical projects and developing process-control strategies, monitoring systems, or manufacturing best practices.
- Experience and/or interest in developing Agentic AI workflows into current or future processes.
Tools
DRAM, NAND, Agentic AI
AI focus
Preferred experience and/or interest in developing Agentic AI workflows into current or future processes.
Model-written summary · the original posting is authoritative