Micron
Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) Engineer/Senior Engineer
Boise, ID - ID1 · Senior · Full-time · Posted Aug 4, 2026
- Experience
- 3+ years in a listed semiconductor-related field and 3+ years performing data analysis.
- Education
- Bachelor's or Master's in Electrical Engineering, Materials Science, Physics, or a related technical field.
About the job
Leads data-driven initiatives to improve semiconductor manufacturing yield, product quality, process integration, and high-value bits per wafer.
What you'll do
- Analyze manufacturing, test, and design data to identify improvement opportunities and develop models for process and equipment performance.
- Partner with cross-functional teams to prototype and deploy analytics solutions and Best Known Methods across production sites.
- Lead projects and continuous improvement efforts that enhance manufacturing performance and deliver measurable business value.
What they ask for
- Bachelor's or Master's in Electrical Engineering, Materials Science, Physics, or a related technical field.
- 3+ years of experience in semiconductor manufacturing, Product Integration Engineering, Product Engineering, Test Engineering, Circuit Design, or a related field.
- 3+ years of data analysis using JMP, Python, Y3, or similar analytical platforms.
- Strong understanding of semiconductor manufacturing processes, equipment, and process control; experience with structured problem-solving and root cause analysis.
Nice to have
- Experience with front-end or back-end process and product integration.
- Experience with statistical modeling, machine learning, artificial intelligence, or advanced analytics applied to manufacturing; knowledge of DRAM, HBM, or advanced packaging.
Tools
JMP, Python, Y3
AI focus
Preferred experience applying machine learning, artificial intelligence, or advanced analytics to manufacturing challenges.
Model-written summary · the original posting is authoritative